Mahesh Wagh
Mahesh Wagh is AMD Sr. Fellow, Server System Architect in the AMD Datacenter System Architecture and Engineering team, developing world-class products and solutions around EPYC processors.
Prior to joining AMD, Mahesh was a Senior Principal Engineer at Intel corporation, focusing on IO and SoC architecture and related technology developments. He has broad experience in chipset and IO architecture, design and validation on both Server and Client platforms.
Some of Mahesh´s significant achievements include the enhancements to PCI Express Architecture and Specification, leading CPU IO domain architecture and IO IP architecture & Interfaces and leading AMD´s Compute Express Link (CXL) efforts.
Paul Crumley
Paul G Crumley, a Senior Technical Staff Member at IBM Research, enjoys creating systems to solve problems beyond the reach of current technology.
Paul’s current project integrates secure, compliant AI capabilities with enterprise Hybrid Cloud allowing clients to extract new business value from their data.
Paul’s previous work includes the design and construction of distributed, and high-performance computing systems at CMU, Transarc, and IBM Research. Projects include The Andrew Project at CMU, ASCI White, IBM Global Storage Architecture, Blue Gene Supercomputers, IBM Cloud, and IBM Cognitive Systems. Paul has managed data centers, and brings his first-hand knowledge of these environments, combined with experience of automation and robustness, to the design of AI for Hybrid Cloud infrastructure.
Debendra Das Sharma
Debendra Das Sharma (Senior Member, IEEE) was born in Odisha, India, in 1967. He received the B.Tech. degree (Hons.) in computer science and engineering from IIT Kharagpur, Kharagpur, India, in 1989, and the Ph.D. degree in computer systems engineering from the University of Massachusetts, Amherst, MA, USA, in 1995.,He joined Hewlett-Packard, Roseville, CA, USA, in 1994, and Intel, Santa Clara, CA, USA, in 2001. He is currently an Senior Fellow with Intel. He is responsible for delivering Intel-wide critical interconnect technologies in Peripheral Component Interconnect Express (PCI Express), Compute Express Link (CXL), Universal Chiplet Interconnect Express (UCIe), Coherency Interconnect, Multi-Chip Package Interconnect, and Rack Scale Architecture. He has been leading the development of PCI-Express, CXL, and UCIe inside Intel as well as across the industry since their inception. He holds 160+ U.S. patents and more than 400 patents worldwide.,Dr. Das Sharma has been awarded the Distinguished Alumnus Award by IIT, in 2019, the 2021 IEEE Region 6 Engineer of the Year Award, the PCI-SIG Lifetime Contribution Award in 2022, and the 2022 IEEE CAS Industrial Pioneer Award. He is currently the Chair of UCIe Board, a Director of PCI-SIG Board, and the Chair of the CXL Board
