Unleashing the transformative power of AI across industries requires overcoming critical barriers to adoption. While AI has shown immense potential for various edge applications, the widespread edge device deployment of vision AI solutions remains elusive. Privacy, reliability, cost, and processing latency concerns demand the integration of edge AI solutions for real-world applications.
In this engaging session, join DEEPX’s CEO Lokwon Kim as he charts a path towards scalable edge AI deployment. Dr. Kim will dive into the challenges hindering widespread adoption and reveal his company’s groundbreaking strategies that empower industries to harness the full potential of Edge AI. Discover how DEEPX revolutionizes affordability, usability, and performance, delivering unrivaled accuracy and flexibility. From cutting-edge algorithms to optimized Edge AI processors, DEEPX’s vision AI processing solutions pave the way for seamless integration and exceptional outcomes across diverse sectors.
Prepare to be inspired as Lokwon Kim present the future of AI, where the power of edge computing converges with industry demands. Gain actionable insights and join the Edge AI revolution with DEEPX, as we propel your organization into a new era of innovation and success.
Lokwon Kim
Dr. Lokwon Kim is CEO of DEEPX. Prior to DEEPX, Dr. Kim spent over a decade in leading research labs and companies such as Apple, Cisco Systems, the IBM Thomas J. Watson Research Center, Broadcom, the Korea Electronics Technology Institute (KETI) and Hynix Semiconductor (now SK hynix), where he played a key role in the design and verification of computer hardware systems used widely around the world. At Apple, Lokwon led design and verification of application processors used in the iPhone, iPad, Apple Watch and more. At Cisco, he played a key role in modeling, design and verification of network router core chipsets. He was the recipient of the Cisco Achievement Program Award in recognition of outstanding employee efforts and achievements. Lokwon earned a PhD in Electrical Engineering at UCLA.