Debendra Das Sharma
Debendra Das Sharma (Senior Member, IEEE) was born in Odisha, India, in 1967. He received the B.Tech. degree (Hons.) in computer science and engineering from IIT Kharagpur, Kharagpur, India, in 1989, and the Ph.D. degree in computer systems engineering from the University of Massachusetts, Amherst, MA, USA, in 1995.,He joined Hewlett-Packard, Roseville, CA, USA, in 1994, and Intel, Santa Clara, CA, USA, in 2001. He is currently an Senior Fellow with Intel. He is responsible for delivering Intel-wide critical interconnect technologies in Peripheral Component Interconnect Express (PCI Express), Compute Express Link (CXL), Universal Chiplet Interconnect Express (UCIe), Coherency Interconnect, Multi-Chip Package Interconnect, and Rack Scale Architecture. He has been leading the development of PCI-Express, CXL, and UCIe inside Intel as well as across the industry since their inception. He holds 160+ U.S. patents and more than 400 patents worldwide.,Dr. Das Sharma has been awarded the Distinguished Alumnus Award by IIT, in 2019, the 2021 IEEE Region 6 Engineer of the Year Award, the PCI-SIG Lifetime Contribution Award in 2022, and the 2022 IEEE CAS Industrial Pioneer Award. He is currently the Chair of UCIe Board, a Director of PCI-SIG Board, and the Chair of the CXL Board